| Title: | Credit Agreement |
| Contract Category: | Credit Agreement |
| Summary: | This Credit Agreement, dated December 8, 2020, is between Qualcomm Incorporated as the Borrower, Bank of America, N.A. as the Administrative Agent, and various lenders and L/C issuers. The agreement outlines the terms for credit extensions and related financial arrangements. |
| Filer: | QUALCOMM INC/DE (QCOM) |
| Parties: | Qualcomm Incorporated Bank of America, N.A. Goldman Sachs Bank USA JPMorgan Chase Bank, N.A. Bofa Securities, Inc. |
| Filing Date: | December 10, 2020 |
| SEC File / Film Number: | 000-19528 / 201380786 |
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